以下是半导体行业的一些常用设备名称及其对应的半导体公司英文名:
1. 光刻机 (Photolithography Equipment)
- ASML (Netherlands)
- Nikon (Japan)
- Canon (Japan)
- TSMC (Taiwan)
2. 刻蚀机 (Etching Equipment)
- Applied Materials (USA)
- Lam Research (USA)
- Tokyo Electron (Japan)
- ASML (Netherlands)
3. 化学气相沉积 (Chemical Vapor Deposition, CVD)
- Applied Materials (USA)
- Tokyo Electron (Japan)
- Hitachi (Japan)
- Lam Research (USA)
4. 离子注入机 (Ion Implanter)
- Varian Semiconductor Equipment Associates (USA)
- Applied Materials (USA)
- Hitachi (Japan)
- IHI (Japan)
5. 化学机械抛光 (Chemical Mechanical Planarization, CMP)
- Applied Materials (USA)
- Nikon (Japan)
- Rodel (USA)
- Entegris (USA)
6. 检测设备 (Inspection Equipment)
- KLA-Tencor (USA)
- ASML (Netherlands)
- Hitachi High-Tech (Japan)
- Oxford Instruments (UK)
7. 分析设备 (Analysis Equipment)
- Hitachi High-Tech (Japan)
- Agilent Technologies (USA)
- Oxford Instruments (UK)
- Bruker (Germany)
8. 刀具和磨料 (Cutting Tools and Abrasives)
- Rodel (USA)
- Disco (Japan)
- Megatron (Japan)
- TAIYO (Japan)
9. 封装设备 (Packaging Equipment)
- Amkor Technology (USA)
- Siliconware Precision Industries (Taiwan)
- STATS ChipPAC (USA)
- Flextronics (USA)
10. 材料供应商 (Material Suppliers)
- Sumco (Japan)
- Shin-Etsu (Japan)
- Nitto Denko (Japan)
- Shin-Etsu Chemical (Japan)
这些设备名称和公司英文名仅为部分示例,半导体行业涵盖了广泛的设备和技术,这里只列举了一部分常见的设备。
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